Original Senju M705-GRN360-K2-V Lead-Free High Temperature Sn96.5Ag3cu0.5 Solder Paste SAC305

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Item No. M99M95A Weight: 0.7 kg
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Original Senju m705-GRN360-k2-v Lead-Free high Temperature Sn96.5Ag3Cu0.5 Solder Paste



Very stable solder paste viscosity over a longer period

  • Lead-free
  • Removal of tip oxidation
  • No-clean compatible formula
  • Minimal residue
  • No need to clean

 

Sepcifications:

Alloy Composition: Sn 96.5: Ag3.0:Cu 0.5
Melting temperature: 217 - 219°C
Powder Size: 25 – 36um
Flux Type: ROL0
SIR (40C 90% RH): Over 1.0 x 1012
Electro-migration Resistance: Over 1.0 x 109 No Migration
Solder paste Viscosity: K1 – 180 ±20 Pa.s; K2 – 200 ±20 Pa.s
Thixotropic Index: 0.6
Flux Content: 11.5%
Hot Slump: 0.4mm
Tackiness: 1.3N

Net Weight: 0.5kg


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